Laminating fiber mould or cardboard packaging
One-sided heating above the forming mould to laminate thin plastic films with high draw depths onto fiber-based packaging.
watttron products address the following challenges:
- Processing of recyclable mono-materials
- Excellent adhesion of the film to the fiber material
- High puncture resistance of the laminated film
- Improved barrier properties
At an Austrian packaging manufacturer, the desired film thickness of 150 µm PP was successfully laminated for the first time in a complex coffee packaging using the Matrix heater. Additionally, by applying targeted heat to specific zones, film bridging was completely prevented.
In a packaging study, uniform lamination of 400 ml yogurt cups with a 150 µm PE film was demonstrated. Matrix heating systems were integrated into the punching grid of a laminating unit, enabling heating, laminating, and punching to be performed within a single tool.
Applications
Cosmetics
Coffee or other premium foods
Packaging Types
Fiber-molded cups
Products
Matrix heating module
- Main component of a matrix heater
- Heating surface size: 40 mm × 40 mm or 40 mm × 50 mm
- Each with 64 or 80 individually controlled heating pixels measuring 5 mm × 5 mm
- Temperature range: up to 200 °C
- Heating power: 22 W/cm²
- Non-stick coating or non-stick film available on the heating surface
- Easy to replace
- Heating rate: 10 K/s
- By combining matrix heating modules, heating surfaces up to 800 mm × 800 mm can be realized
Complete price for matrix heater:
€64 per cm² of heating surface*
*Price for machine operators. Reduced pricing applies for machine builders.
Matrix heater standard (bottom or lid heating)
- Compatible with all thermoformers for installation and retrofit
- IP65 rated
- Media supply via separate plug connectors
- Fixed position of the heating surface
Matrix heater lid heating
- Optimized for installation and retrofit on Multivac machines
- IP67 rated
- Fully integrated into thermoforming lids
- Adaptable to different film thicknesses via adjustable heating surface position between 0.2 and 1.7 mm behind the frame
- Media supply through connection block
