Pack Expo Chicago
18.-21.10.2026
We are pleased to invite you to our booth at PackExpo International. Take the opportunity to talk to us about the latest innovations in packaging technology.
We look forward to seeing you there!
Booth N-5686
• Simulation of thermoforming processes
• Simulation of compression pressure behavior
• Simulation of temperature influences
• Access via a protected infrastructure with role rights management
• Uploading CAD data to create a heating profile by simulation
• Adaptation of heating profile parameters with immediate transfer to the production process
• Automatic notification of errors or recommended maintenance measures
• Provision of calibration data
Pouch bags and other (secondary) packaging for sterile products
More efficiency, less packaging
More efficiency, less packaging
New materials such as monomaterial
Forming of SMD-assembled films
New possibilities for lightweight construction
Temperature control for laboratory equipment and analytical processes.
Pouch bags and other (secondary) packaging for sterile products
We are pleased to invite you to our booth at PackExpo International. Take the opportunity to talk to us about the latest innovations in packaging technology.
We look forward to seeing you there!
Booth N-5686