watttron at PACK EXPO International 2026
From October 18–21, 2026, watttron will present the next generation of digital heating technology for the packaging industry at PACK EXPO International in Chicago. Visit us at Booth N-5686 and experience how precise temperature control sets new standards in sealing, thermoforming, and quality control.
Discover innovative solutions for processing sustainable packaging materials, enhanced process reliability, and maximum efficiency. In direct exchange with our experts, learn how digital heating technology helps make packaging processes more powerful, economical, and future-proof.
We look forward to discussing the challenges and opportunities of tomorrow’s packaging industry with you.
