Inno Pouch 2026
Digital sealing for data-driven packaging processes On October 9, 2026, Dr. Sascha Bach will speak at the industry event INNO-Pouch: Smart Pouches – Digital, Compliant, Tight about data-driven packaging processes. In his presentation “Digital Sealing – enabling data driven process and quality monitoring”, he will introduce watttron’s digital sealing technology. The technology enables continuous recording […]
Pack Expo International 2026
watttron at PACK EXPO International 2026 From October 18–21, 2026, watttron will present the next generation of digital heating technology for the packaging industry at PACK EXPO International in Chicago. Visit us at Booth N-5686 and experience how precise temperature control sets new standards in sealing, thermoforming, and quality control. Discover innovative solutions for processing […]
SemiCon West 2026
📍 San Francisco, US From October 13-15, 2026, watttron will be at SEMICON West in San Francisco. There, we will present our innovative digital heating technologies for the semiconductor industry and demonstrate how precise temperature control creates new opportunities for efficient, reliable, and sustainable production processes. Visit us on-site to learn more about our solutions […]
